CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

BFG325W/XR,115

Manufacturer No:

156

Manufacturer:

NXP USA Inc.

Quantity:

9999

Model:

default

Datasheet:

BFG325W/XR,115

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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BFG325W/XR,115

RF TRANS NPN 6V 14GHZ CMPAK-4

  • Type
    Parameter
    Select All
  • Mfr

    NXP USA Inc.

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Obsolete

  • Transistor Type

    NPN

  • Voltage - Collector Emitter Breakdown (Max)

    6V

  • Frequency - Transition

    14GHz

  • Noise Figure (dB Typ @ f)

    1.1dB @ 2GHz

  • Gain

    18.3dB

  • Power - Max

    210mW

  • DC Current Gain (hFE) (Min) @ Ic, Vce

    60 @ 15mA, 3V

  • Current - Collector (Ic) (Max)

    35mA

  • Operating Temperature

    175°C (TJ)

  • Mounting Type

    Surface Mount

  • Package / Case

    SC-82A, SOT-343

  • Supplier Device Package

    CMPAK-4

  • Base Product Number

    BFG32

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

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